Tower, the global specialty foundry leader, manufactures integrated circuits for more than 150 customers worldwide. It offers the widest range of customizable CMOS specialty wafer processes and provides world-class design enablement tools for the quickest path to design success. Its modular processes enable superior solutions for targeted designs, quickly meeting the customers’ needs and facilitating fast time-to-market for their innovative products. It also offers process transfer and optimization services for IDMs and fabless companies to expand capacity or provide second sourcing. Its customers are focused on markets including RF, High-Performance Analog, Power, Imaging, Consumer, Automotive, Medical, Industrial, and Aerospace & Defense. Tower Semiconductor is publicly traded on NASDAQ (TSEM) and Tel Aviv Stock Exchange (TSEM).
In addition to digital CMOS process technology, Tower offers specialty CMOS processes with geometries ranging from 1.0— to 0.13-micron, including: SiGe, BiCMOS, Mixed-Signal & RFCMOS, CMOS Image Sensor (CIS), Power Management (BCD), and Embedded Non-Volatile Memory (NVM) as well as CMOS + MEMS integrated capabilities. It also provides an industry recognized design enablement infrastructure of tools and accurate device models for near zero design risk for analog and RF designs. By offering the widest range of specialty process technologies combined with the most complete solution of proven design tools and capabilities, it reduces the number of foundry suppliers needed by its customers. For global capacity assurance, it offers manufacturing on three continents; two fabs (150mm and 200mm) in Israel, a 200mm fab in the U.S., and access to additional capacity through foundry partnerships in China.
Tower is headquartered in Migdal Haemek, Israel and its U.S subsidiary is located in Newport Beach, California.
Dr. Daniel Nahmad graduated in Physics in Milan (ITALY), 5 years, Atomic e molecular orientation. He worked for STMicroelectronics in Milan in the Central R&D for these positions:
S.Process Engineer of the Pilot Line: set up of the process recipes, optimization of the process, Statistical Process Control, development of the software for the process control of the equipment.
Device Engineer: process integration of new products, the process control, defectivity control, and the yield enhancement. He published works on the Tunnel Oxide defectivity and his impact on reliability of the flash Eeproms. He has the responsibility of flash EEPROM’s products, from the production to the electrical testing, Electrical Wafer Sort testing and product qualification.
Reliability Engineer: Department of Dedicated Product Group of the same company. This department attends to the qualification of power supply, motor drives, and switching regulators ecc. in BCD technology for dedicated customers.
In January ’99 he moved to a company of semiconductor in ISRAEL, TOWER S.L., Migdal Ha’emek, in the following positions:
S.Device Engineer of Technology Development, in the project of non-volatile memories: He was in charge of the Cycling and Reliability at Product Level of the Sort Test program development of the new Products and of in the Yield Enhancement of the new products.
Device Group leader: From the 2000 year he had a group that was working on the product device characterizations and he dedicated himself on the integration between design, the device and the testing of the new products.
Device Section Head: from the 2004 he was in charge of the NVM Device engineering in the R&D of Tower. He had the responsibility of the development of the new memories, embedded and standard logic, from the test chip design and evaluation to the characterization and qualification of the final product.
Project Manager: from the 2007 he is in charge of the management of the NVM projects of the R&D in Tower, embedded memories in standard logic or more complex flow. He has the responsibility of all the aspects of the projects, from the development phase to the productization and qualification.